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Index
COVER
TITLE PAGE
COPYRIGHT
TABLE OF CONTENTS
LIST OF CONTRIBUTORS
INTRODUCTION
1 A PREDICTIVE MODEL FOR WHISKER FORMATION BASED ON LOCAL MICROSTRUCTURE AND GRAIN BOUNDARY PROPERTIES
1.1 INTRODUCTION
1.2 CHARACTERISTICS OF WHISKER AND HILLOCK GROWTH FROM SURFACE GRAINS
1.3 SUMMARY AND RECOMMENDATIONS
ACKNOWLEDGMENTS
REFERENCES
2 MAJOR DRIVING FORCES AND GROWTH MECHANISMS FOR TIN WHISKERS
2.1 INTRODUCTION
2.2 UNDERSTANDING THE MECHANISMS BEHIND IMC-INDUCED STRESS EVOLUTION AND WHISKER GROWTH
2.3 RELATION OF STRESS TO WHISKER GROWTH
2.4 CONCLUSIONS
ACKNOWLEDGMENTS
REFERENCES
3 APPROACHES OF MODELING AND SIMULATION OF STRESSES IN Sn FINISHES
3.1 INTRODUCTION
3.2 CONSTITUTIVE MODEL
3.3 STRAIN ENERGY DENSITY
3.4 GRAIN ORIENTATION
3.5 FINITE ELEMENT MODELING OF TRIPLE-GRAIN JUNCTION
3.6 FINITE ELEMENT MODELING OF S FINISH WITH MULTIPLE GRAINS
REFERENCES
4 PROPERTIES AND WHISKER FORMATION BEHAVIOR OF TIN-BASED ALLOY FINISHES
4.1 INTRODUCTION
4.2 GENERAL PROPERTIES OF TIN-BASED ALLOY FINISHES (ASAO NISHIMURA)
4.3 EFFECT OF ALLOYING ELEMENTS ON WHISKER FORMATION AND MITIGATION (ASAO NISHIMURA)
4.4 DEPENDENCE OF WHISKER PROPENSITY OF MATTE TIN–COPPER FINISH ON COPPER LEAD-FRAME MATERIAL (TAKAHIKO KATO)
4.5 CONCLUSIONS
ACKNOWLEDGMENTS
REFERENCES
5 CHARACTERIZATION TECHNIQUES FOR FILM CHARACTERISTICS
5.1 INTRODUCTION
5.2 TEM (TAKAHIKO KATO)
5.3 SEM (YUKIKO MIZUGUCHI)
5.4 EBSD (YUKIKO MIZUGUCHI)
5.5 CONCLUSIONS
ACKNOWLEDGMENTS
REFERENCES
6 OVERVIEW OF WHISKER-MITIGATION STRATEGIES FOR HIGH-RELIABILITY ELECTRONIC SYSTEMS
6.1 OVERVIEW OF TIN WHISKER RISK MANAGEMENT
6.2 DETAILS OF TIN WHISKER MITIGATION
6.3 MANAGING TIN WHISKER RISKS AT THE SYSTEM LEVEL
6.4 CONTROL OF SUBCONTRACTORS AND SUPPLIERS
6.5 CONCLUSIONS
REFERENCES
7 QUANTITATIVE ASSESSMENT OF STRESS RELAXATION IN TIN FILMS BY THE FORMATION OF WHISKERS, HILLOCKS, AND OTHER SURFACE DEFECTS
7.1 INTRODUCTION
7.2 SURFACE-DEFECT CLASSIFICATION AND MEASUREMENT METHOD
7.3 PREPARATION AND STORAGE CONDITIONS OF ELECTROPLATED FILMS ON SUBSTRATES
7.4 SURFACE DEFECT FORMATION AS A FUNCTION OF TIN FILM TYPE, SUBSTRATE, AND STORAGE CONDITION
7.5 CONCLUSIONS
APPENDIX
ACKNOWLEDGMENTS
REFERENCES
8 BOARD REFLOW PROCESSES AND THEIR EFFECT ON TIN WHISKER GROWTH
8.1 INTRODUCTION
8.2 THE EFFECT OF REFLOWED COMPONENTS ON TIN WHISKER GROWTH IN TERMS OF GRAIN SIZE AND GRAIN ORIENTATION DISTRIBUTION
8.3 REFLOW PROFILES AND THE EFFECT ON TIN WHISKER GROWTH
8.4 INFLUENCE OF REFLOW ATMOSPHERE AND FLUX ON TIN WHISKER GROWTH
8.5 EFFECT OF SOLDER PASTE VOLUME ON COMPONENT TIN WHISKER GROWTH DURING ELECTRONICS ASSEMBLY
8.6 CONCLUSIONS
ACKNOWLEDGMENTS
REFERENCES
9 MECHANICALLY INDUCED TIN WHISKERS
9.1 INTRODUCTION
9.2 OVERVIEW OF MECHANICALLY INDUCED TIN WHISKER FORMATION
9.3 THEORY
9.4 CASE STUDIES
9.5 CONCLUSIONS
REFERENCES
INDEX
END USER LICENSE AGREEMENT
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