Transmit Receive Modules for Radar and Communication Systems by Sturdivant, Rick -- Read -- Imperial Library of Trantor

Index

Title Page Copyright Page Dedication Contents Preface Acknowledgments 1. Phased Arrays

1.1 Phased Arrays in Radar and Communication Systems 1.2 Antennas 1.3 Antenna Patterns and Line Arrays 1.4 Electronically Steerable Antennas 1.5 Radar Equation for Targets 1.6 Radar Equation for Weather 1.7 Phased Arrays for Communication Systems 1.8 Conclusions Problems References

2. Transmit/Receive Modules

2.1 Introduction to Transmit/Receive Modules 2.2 Early T/R Module Development Efforts 2.3 MMIC-Based T/R Modules 2.4 T/R Module Performance Requirements 2.5 T/R Module Components

2.5.1 Transmit/Receive Switches 2.5.2 Phase Shifter 2.5.3 Attenuators 2.5.4 Core Chip 2.5.5 Driver Amplifier 2.5.6 Power Amplifier 2.5.7 Circulator or Duplexer 2.5.8 Limiter or Receive Protect Circuit 2.5.9 Low-Noise Amplifier

2.6 Module Control and Power Conditioning 2.7 Conclusions Problems References

3. Semiconductors for T/R Modules

3.1 Introduction 3.2 Semiconductor Materials

3.2.1 GaAs 3.2.2 Heterostructures 3.2.3 SiC 3.2.4 GaN 3.2.5 InP 3.2.6 SiGe

3.3 RF Semiconductor Wafer Fabrication Processes

3.3.1 Isolation 3.3.2 Ohmic Contacts 3.3.3 Gate Formation 3.3.4 Dielectric Deposition 3.3.5 Electroplating 3.3.6 Air Bridges

3.4 Active Devices

3.4.1 GaAs MESFETs 3.4.2 GaAs PHEMTs 3.4.3 GaN HEMTs

3.5 MMICs 3.6 Conclusions Problems References

4. Signal Integrity Issues in T/R Modules

4.1 Introduction to Signal Integrity 4.2 Chip-Level Interconnects

4.2.1 Wire Bonding Methods 4.2.2 Wire Bond Modeling 4.2.3 Flip-Chip Methods

4.3 Package/Module-Level Interconnect

4.3.1 Module Interconnects 4.3.2 SMT Package Interconnects

4.4 Transmission Line Interconnects 4.5 Coupling Between Interconnects 4.6 Vertical Transition Interconnects 4.7 Module Resonances 4.8 Conclusions Problems References

5. Materials for T/R Modules

5.1 Introduction to Materials 5.2 Electrical Parameters and Their Measurement

5.2.1 Dielectric Constant 5.2.2 Loss Tangent 5.2.3 Measurement of Dielectric Constant and Loss Tangent 5.2.4 Metal Electrical Conductivity

5.3 Mechanical Parameters

5.3.1 Thermal Conductivity

5.4 Ceramic Materials

5.4.1 Thin-Film Ceramic 5.4.2 Thick-Film Ceramic 5.4.3 Thermally Enhanced Thick-Film Processes 5.4.4 High-Temperature Co-Fired Ceramic (HTCC) 5.4.5 Low-Temperature Co-Fired Ceramic (LTCC) Materials

5.5 Laminate Packaging

5.5.1 Laminate Board Fabrication 5.5.2 High-Performance Laminate Materials 5.5.3 Liquid Crystal Polymers 5.5.4 MCM-L Laminate Multichip Modules

5.6 Conclusions Problems References

6. Heat Issues and Solutions for T/R Modules

6.1 Introduction to Thermal Issues and Solutions 6.2 Heat Flux in MMIC High-Power Amplifiers 6.3 Amplifier Efficiency and Dissipated Thermal Power 6.4 Thermal Resistance and Device Junction Temperature 6.5 Example of Heat Dissipated by Components in a T/R Module 6.6 Reliability Calculations 6.7 Diamond-Enhanced GaN High-Power Amplifiers for T/R Modules 6.8 Thermal Simulations Using SPICE 6.9 Thermal Measurements

6.9.1 Electrical Test Methods 6.9.2 Optical Methods 6.9.3 Temperature Measurements Using Liquid Crystal Thermography 6.9.4 Thermal Design Using Surrogate Validation Chips

6.10 Conclusions Problems References

7. MMIC Fabrication and T/R Module Manufacturing

7.1 Introduction 7.2 MMIC Fabrication

7.2.1 MMIC Facilities 7.2.2 MMIC Fabrication Processes 7.2.3 MMIC Foundry Procedures

7.3 T/R Module Manufacturing

7.3.1 T/R Module Manufacturing Facilities 7.3.2 T/R Module Manufacturing Processes

7.4 Conclusions Problems References

8. Testing of MMICs and T/R Modules

8.1 Introduction to Testing 8.2 MMIC Testing

8.2.1 Incoming Materials Testing 8.2.2 In-Process Testing 8.2.3 On-Wafer RF Testing 8.2.4 MMIC Screening Tests 8.2.5 MMIC Reliability Testing

8.3 T/R Module Specifications 8.4 T/R Module Testing

8.4.1 Key Electrical Parameters 8.4.2 Example of Key Parameter Requirements on an X-Band T/R Module 8.4.3 Automated Electrical Test Set

8.5 Conclusions Problems References

9. MMIC and T/R Module Cost

9.1 Introduction 9.2 MMIC Cost

9.2.1 MMIC Wafer Fabrication Cost 9.2.2 Wafer Fabrication Process Yield 9.2.3 Wafer Diameter Impact on MMIC Cost 9.2.4 Impact of MMIC Fabrication Facility Loading on Cost 9.2.5 MMIC Cost Based on Area or Output Power

9.3 T/R Module Cost 9.4 Cost Reduction

9.4.1 MMIC Cost Reduction 9.4.2 T/R Module Cost Reduction

9.5 Conclusions Problems References

10. Next-Generation T/R Modules

10.1 Introduction 10.2 Single-Chip T/R Module 10.3 Wafer-Scale Phased Array 10.4 Si-CMOS: The Lowest-Cost Single-Chip T/R 10.5 Digital Beamforming 10.6 Hybrid Digital/Analog Beam Forming 10.7 Switch Beam and Butler Matrix Phased Arrays 10.8 Highly Integrated Packaging of T/R Modules 10.9 Path to Low-Cost Systems: Open Architectures 10.10 Conclusions Problems References

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